SO-IC with gullwings
Description:
Dewetting of tinning at heel area of gullwing lead. The tinning has cracked, so that the copper underneath can corrode. The solderability of these components is jeopardized. Components which show such or a similar condition of their surface should not be used in production.
Causes/Remedy:
- manufacturing fault
- replace such components
Source:SEM
Description:
Dewetting and cracks at the bends of the gullwings of an SO-IC affecting all bends of the lead. Particular attention has to be paid to solderability, especially to the solder fillet at the lead heel. There is the constant risk of corrosion at the underlying carrier.
Causes/Remedy:
- manufacturing fault
- replace such components
Source:visual, optical inspection - general view
SOD
Description:
Dewetting of contact areas of SO diodes on arrival (middle, right). Using components with such appearances can lead to soldering defects since solderability is considerably reduced. There is the constant risk of corrosion at the contacts.
Causes/Remedy:
- manufacturing fault
- replace such components
Source:visual, optical inspection - general view
Description:
Open at a SO diode due to a deviation in the form of the casing (banana diode). Its influence on solderability can clearly be seen.
Causes/Remedy:
- manufacturing fault
- replace such components
Source:SEM
Cracks in Ta-capacitors Type C (6032)
Description:
Crack in the plastic casing of a Ta capacitor. This defect is likely to lead to a failure of the component. Another striking feature is the distinct burrs at the seams of the plastic parts and at the contacts.
Causes/Remedy:
- manufacturing fault
- replace such components
Source:visual, optical inspection - general view
Description:
Crack in the plastic casing (detailed view).
Causes/Remedy:
- manufacturing fault
- replace such components
Source:visual, optical inspection - general view
SMD - inductivity (special component)
Description:
Damaged insulating wires of a SMD inductivity. The insulation has cracked due to mechanical stress. The design makes this component prone to mechanical damage.The defect shown can lead to bridging during wave soldering.
Causes/Remedy:
- manufacturing fault
- avoid using these components in general
Source:SEM
Crack in MiniMELF
Description:
The body of this MiniMELF cracked during a solderability test. These components should pass the test without any problems and not show any defects at the body
Causes/Remedy:
- manufacturing fault
- replace such components
Source:visual, optical inspection - general view
Our analytics team can help you find the cause.
go to failure analysis at TechnoLab