Description:
Damage to through-hole as well as to the neighbouring base material due to inexpert treatment of assembly. Not acceptable.
Causes/Remedy:
- damage due to inexpert transport or storage
- damage caused by machines (pick and place machine)
![Beschädigung einer Durchkontaktierung sowie des angrenzenden Basismaterials](../images/pcb/pcb_mechbeschae.jpg)
visual, optical inspection - general view
Description:
Same context as described above - microsection
Causes/Remedy:
- damage due to inexpert transport or storage
- damage caused by machines (pick and place machine)
![Schliffbild einer mechanischen Beschädigung einer Durchkontaktierung](../images/pcb/pcb_mechbesch2.jpg)
Microsection
Do you have problems with delamination ?
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Our analytics team can help you find the cause.
go to failure analysis at TechnoLab