Description:
Delamination is partial separation of the layers of the base material (PCB, multilayer). Their appearance (though smaller) is similar to that of blisters. Delamination is caused by humidity which the laminate has absorbed or which has been added during the production process. Applying heat leads to the formation of gases which then produce this result.
Causes/Remedy:
- humidity in the (organic) base material
- excessive thermal stress during soldering
- This defect can be avoided through tempering
Source:visual, optical inspection - general view
Description:
Same context as described above. Example of extensive delamination
Causes/Remedy:
- humidity in the (organic) base material
- excessive thermal stress during soldering
Source:visual, optical inspection - general view
Do you have problems with delamination ?
Our analytics team can help you find the cause.
go to failure analysis at TechnoLab
Our analytics team can help you find the cause.
go to failure analysis at TechnoLab