Description:
You can clearly identify inclusions (blisters) within the base material on the left and right of the through-hole. Blisters are local separations between the layers of the base material (inclusions of air, solvent, humidity). In general, these defects are tolerated,if detected at all.
Causes/Remedy:
- deficiency in the production of the base material
- inadequately high temperature stress during soldering
Source:Microsection
Description:
Detailed view of previous example
Causes/Remedy:
- deficiency in the production of the base material
- inadequately high temperature stress during soldering
Source:Microsection
Do you have problems with blistering ?
Our analytics team can help you find the cause.
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Our analytics team can help you find the cause.
go to failure analysis at TechnoLab