| µBGA |
Mikro Ball Grid Array |
SMT |
| ASIC |
Application Specific Integrated Circuit |
BE |
| BGA |
Ball Grid Array |
SMT |
| C-Flat Pack |
Ceramic Flat Pack |
SMT |
| C-LCC |
Ceramic Leaded Chip Carrier |
SMT |
| CMC |
Ceramic Multilayer Capacitor |
SMT |
| COB |
Chip on Board |
SMT |
| C-PGA |
Ceramic Pin Grid Array |
HMT/THD |
| CSP |
Chip Scale Package |
- |
| DIP |
Dual Inline Package |
HMT/THD |
| DRAM |
Dynamic Random Access Memory |
BE |
| FC |
Flip Chip |
SMT |
| FCIP |
Flip Chip in Package |
- |
| FCO |
Flip Chip on Board |
SMT |
| FPC |
Flexible Printed Circuit |
PCB |
| LB |
Lead Bonding |
- |
| LF |
Lead Frame |
- |
| OSC |
Odd Shaped Component |
BE |
| MCM |
Multi Chip Module |
SMT |
| MID |
Molded Interconnection Device |
PCB |
| RCC |
Resin Coated Copper |
PCB |
| PCB |
Printed Circuit Board |
PCB |
| P-LCC |
Plastic Leaded Chip Carrier |
SMT |
| P-QFP |
Plastic Quad Flat Pack |
SMT |
| P-SO |
Plastic Small Outline |
SMT |
| P-TSOP |
Plastic Thin Small Outline Package |
SMT |
| SIP |
Single Inline Package |
HMT/THD |
| SMD |
Surface Mount Device |
SMT |
| SMT |
Surface Mount Technology |
SMT |
| SO |
Small Outline |
SMT |
| SOD |
Small Outline Diode |
SMT |
| SOJ |
Small Outline J-Lead |
SMT |
| SOT |
Small Outline Transistor |
SMT |
| SSOP |
Shrink Small Outline Package |
SMT |
| TAB |
Tape Automated Bonding |
SMT |
| TCP |
Tape Carrier Package |
SMT |
| THP |
Through Hole Package |
HMT/THD |
| THT |
Through Hole Technology |
HMT/HMD |
| TO |
Transistor Outline |
BE |
| TSOP II |
Thin Small Outline Package, Type II |
SMT |
| UTSOP |
Ultra Thin Small Outline Package |
SMT |
| ZIP |
Zigzag Inline Package |
HMT/THD |
